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High-Speed, Dual-Phase Driver
with Integrated Boost Diodes
PCB Layout
The MAX8811 sources and sinks large currents to drive
MOSFETs at high switching speeds. The high di/dt can
cause unacceptable ringing if the trace lengths and
impedances are not well controlled. The following PCB
layout guidelines are recommended when designing
with the MAX8811:
1) Place all decoupling capacitors as close to their
respective pins as possible.
2) Minimize the high-current loops from the input capac-
itor, upper switching MOSFET, and low-side MOSFET
back to the input capacitor negative terminal.
4) Connect PGND1 and PGND2 as close as possible
to the source of the low-side MOSFETs.
5) Keep LX1 and LX2 away from sensitive analog com-
ponents and nodes.
6) Gate drive traces should be at least 20 mils wide,
kept as short as possible, and tightly coupled to
reduce EMI and ringing induced by high-frequency
gate noise. Adjacent DH_ and LX_ traces should be
tightly coupled.
A sample evaluation layout is available in the MAX8811
Evaluation Kit.
3) Provide enough copper area at and around the
switching MOSFETs and inductors to aid in thermal
dissipation.
PROCESS: BiCMOS
Chip Information
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